Partners

ICOS Vision Systems, a division of KLA Corporation. KLA Corporation is a leading supplier of process equipment, process control equipment, and data analytics products for a broad range of industries, including semiconductors, printed circuit boards and displays. We provide advanced process control and process-enabling solutions for manufacturing and testing wafers and reticles, integrated circuits, packaging, light emitting diodes, power devices, compound semiconductor devices, microelectromechanical systems, data storage, printed circuit boards and flat and flexible panel displays, as well as general materials research. Semiconductor process control products and services include inline unpatterned and patterned wafer defect inspection, review and classification; reticle defect inspection and metrology; packaging inspection and die sort; critical dimension (CD) metrology; pattern overlay metrology; film thickness, surface topography and composition measurements; measurement of in-chamber process conditions; wafer shape and stress metrology; computational lithography tools; and, overall yield and fab-wide data management and analytics.

The ICOS division is developing inspection and metrology systems for the semiconductor packaging and advanced packaging market. The four ICOS product lines include automated inspection/metrology systems for package-level (ICOS-CI and MV), die-level (ICOS-F160), and wafer-level (Zeta).

RoodMicrotec is a leading independent company for semiconductor supply and quality services. With 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The company provides full-turnkey ASIC services for complex microchips that are individually tailored to handle specific applications for every single customer. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarter is located in Deventer, the Netherlands, with operational units in Nördlingen and Stuttgart, Germany.

Nuromedia GmbH is an independent software engineering company founded in 2005 by experts of media industry, with profound expertise of international R&D, with offices in Cologne (Germany, head office) and Berlin.

Our expertise covers software development, VR/AR development, server development, gamification, AI, Machine Learning, Big Data, Blockchain, ICT solutions for ehealth, elearning, Smart City, Smart Factory, Industry 4.0. etc.

Nuromedia covers the entire chain of software and research project development – from the initial idea to final production / implementation – and has a wealth of experience in developing web, mobile and cross-platform.

By participating in research & development projects within national and international research consortia, Nuromedia ensures that its projects will always utilize the most advanced state-of-the-art technology.

PacTech provides state-of-the-art automated equipment to the Wafer Level Packaging and Backend Industries.  This equipment is divided into three separate platforms: electroless-Ni/Au Plating, Solder Bumping, and Backend Assembly.

The fully automatic electroless plating line (PacLine™ Series 200 and 300) allows the processing of 100-300mm wafers with Ni, Pd and Au at volumes of 600,000 parts per year. In addition, PacTech offers the peripheral equipment associated with electroless plating, including: plasma clean (PlasPac), resist and dielectric coating (ASC 200/300), megasonic solvent cleaning (MegaPac).

PacTech offers two different equipment platforms for solder deposition. These include the Laser Assisted Solder Jetting (SB²) and the Wafer Level Solder Balling (Ultra-SB²) machines. The SB²-Jet is ideal for processing MEMS, Defense and Medical applications; as well as single die, probe cards, substrates, Hard Disc Drive heads and camera modules. The Ultra-SB² is ideal for high yield and high volume Wafer Level Solder Balling applications.

To facilitate a full turnkey solution to their equipment line, PacTech offers a full set of additional equipment for Wafel Level Packaging and Backend pplications, including: laser based assembly tools LAPLACE -FC, LAPLACE-Cap, LAPLACE-Can, Laser Marking (LS²) and Reflow Oven.

DISCO Corporation is a leading manufacturer for equipment and tools for wafer thinning and dicing.

The rapid development of the semiconductor industry and the digitization of information have advanced the requirements for the abrasive and precision industry. By rapidly adapting to market needs and delivering on-demand technologies, DISCO Corporation has established itself as a market leader in dicing (Kiru), grinding (Kezuru) and polishing (Migaku) technologies. By combining these three core technologies, DISCO provides total solutions to meet the more and more demanding requirements of the Semiconductor industry in terms of manufacturing thin dies with high die-strength and several new approaches for advanced packaging.

Founded in 1937, DISCO can look back on 80 years of company history. Today, DISCO Corporation has over 50 affiliates in 16 countries worldwide. The DISCO Headquarter is located in Omori, Tokyo.

DISCO HI-TEC EUROPE GmbH is the European head office of DISCO Corporation, featuring demo labs and dicing-grinding services. Its turnover reaches up to EUR 80 Mio. per year. There are 100 employees in Europe and 4.600 employees within DISCO Corporation worldwide. The clean room in Munich has been expanded within the last years and now has a total size of 1.200 m² and facilitates over 30 machines to meet the increasing demand of customer inquiries for application optimization and wafer procession. Currently over 12.000 are processed each month.

  • Founded 1977 by Prof. Dr.-Ing. Dr.-Ing. E.h. Peter Osypka
  • Headquarters in Rheinfelden-Herten, Germany, near Basel, Swiss border
  • OSYPKA is known for over 40 years as a manufacturer of reliable, high quality medical devices
  • OSYPKA offers its experience and in-house capabilities also to partners and third parties in the medical device field
  • OSYPKA designs, develops and manufactures products with the focus on pacing, electrophysiology,
    cardiac surgery and interventional adult and pediatric cardiology
  • OSYPKA is privately owned and operated together with the charitable „Peter-Osypka Foundation“
  • OSYPKA is certified according to DIN EN ISO 13485:2016
The Fraunhofer-Gesellschaft (FHG) is one of the leading organizations of applied research in Europe, undertaking contract research on behalf of industry, the service sector and government. At present, the organization maintains 67 Fraunhofer Institutes in Germany, with a staff of around 24,000 scientists and engineers. Fraunhofer IZM’s focus is on packaging technology and the integration of multifunctional electronics into systems and also covers all aspects for advanced packaging e.g. process development, qualification and reliability & failure analysis with specific links to WL packaging and 3D heterogeneous integration. Fraunhofer ENAS stands for design, development, and test of smart systems comprising sensors, actuators, and electronics. In the field of reliability research, it has a long record of identifying the physics of failure and possible weak points in new components and systems, of developing new strategies and schemes for virtual prototyping and design for reliability by validated numerical simulations, and of transferring these methods into industrial practice. Fraunhofer IMS. For over 30 years scientists at Fraunhofer IMS in Duisburg have been dealing with the development of microelectronic circuits, electronic systems, microsystems and sensors. Because of its comprehensive know-how, the access to technology and the high-quality development work the Institute is a worldwide recognized partner for the industry. In eight business units Fraunhofer IMS is dedicated to applied research, advance development for products and their applications. Stable, efficient and marketable technologies and procedures that are used in extremely many branches take center stage in contract work.

The Würth Elektronik group of companies is a legally independent part of the international Würth Group. The Würth Elektronik group comprises the following business areas and companies:

  • Würth Elektronik eiSos is one of the leading manufacturers of electronic and electromechanical components in Europe
  • Würth Elektronik Circuit Board Technology (CBT) has established itself as one of the leading printed circuit board (PCB) manufacturers in Europe
  • Würth Elektronik ICS develops and manufactures printed circuit board-based system solutions for signal and power distribution, electronic control, display and control panels.

Würth Elektronik Circuit Board Technology has specialized the manufacturing of circuit boards in small to medium-sized orders in all prevalent surfaces and has over 1,000 employees, the vast majority of employees work in the three German production plants. Every day, more than 120 new circuit board designs go through the production line: from the initial idea for a system, such as within the scope of development projects, to samples and prototypes, right through to series production in medium and large volumes. More than 4,000 customers range from major corporations to one-man design offices. In addition to providing personal support by means of a dense network of more than 100 employees on the sales force and in-house staff, the customers also have the option of purchasing circuit boards online through the convenient web shop. Würth Elektronik has a strong culture of innovation, characterised by a focus on promoting technical advancement, research & development as well as a rapidly increasing number of patents. This is because our aim is to be your first choice partner for innovations in electronics and to pre-empt the challenges of tomorrow and meet your needs in terms of intelligent products and systems.

Besi Netherlands BV is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. Besi’s customers are primarily leading multinational chip manufacturers, assembly subcontractors and electronics and industrial companies.

Besi Netherlands BV is part of Besi NV which is a leading assembly equipment supplier with

  • Broad portfolio for die attach, packaging and plating
  • Strategic positioning in wafer level and substrate packaging

Global manufacturing operations in 6 countries. HQ in Duiven, the Netherlands

Advanced Packaging Center (APC) is an SME company based in the Netherlands. APC targets at one-stop shop delivery of research, development, qualification, prototyping and small to medium volume manufacturing services. APC can assist customers to transfer from development to proto-typing to production and focuses specially on MEMS, Sensors, Power, Photonic and advanced IC packaging. APC provides added value from Innovation to Industrialization (I2I).

In the area of these advanced IC’s, our patented molding technology Film Assist Molding (FAM) and Ag sinter technology can offer more flexibility to the design options for the customer and material choices. Our FAM Technology (initially developed by Boschman Technologies) is in production for over 10 years and has already an extensive number of different products qualified. The application range is wide from consumer electronics to automotive and medical industry.

Imec NL aims to be the world-leading R&D and innovation hub in nanoelectronics and digital technologies. As a trusted partner for companies, startups and academia we bring together brilliant minds from all over the world in a creative and stimulating environment. By leveraging our world-class infrastructure and local and global ecosystem of diverse partners across a multitude of industries, we are accelerating progress towards a connected, sustainable future.

JSR Corporation is a multinational company employing over 7,000 people worldwide and a leading materials supplier in a variety of technology driven markets. JSR’s global network is headquartered in Tokyo (Japan) and has factories and offices in Japan, Europe, US, China, Taiwan and Korea. JSR is a research-oriented organization that pursues
close collaborations with leading innovators in a number of industries that are a key to the present and future welfare of human society: electronic materials, life-sciences, synthetic rubbers, display and optical materials.
JSR has a very strong expertise in the field of Polymer Technology, which enabled the company to successfully enter the semiconductor business 40 years ago. Nowadays, JSR has a large portfolio of high-performance semiconductor lithography materials and continues to invest in the research and development of the next generation products.
JSR Micro NV is a subsidiary of JSR Micro Corporation Japan. Located in Leuven, Belgium, we produce specific materials for the semiconductor industry.

Imec BE performs world-leading research in nanoelectronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society. Imec is headquartered in Leuven, Belgium, and has offices in Belgium, the Netherlands, Taiwan, US, China, India and Japan. Its staff of close to 2,000 people includes more than 600 industrial residents and guest researchers.

AFORE is a pioneer in MEMS test equipment industry and offers a range of advanced test solutions for MEMS devices, including the world’s only commercial Wafer-Level Chip Scale Packaging (WLCSP) MEMS test solution for motion sensors. Afore’s solutions are used in MEMS development and manufacturing in the automotive, industrial, and consumer sectors in Europe, USA and Japan. Afore was founded in 1995 and serves its global customers from its headquarters in Lieto, Finland.

AFORE is part of AEM Group, taking pride in providing innovative, engineering-focused solutions and developing strong partnerships with customers and associates to cater to their manufacturing needs through our global engineering service support network and innovative people. Currently, AEM has 3 manufacturing plants located in Singapore, Malaysia (Penang) and China (Suzhou).

Through network of sales offices, associates and distributors, AEM and Afore have global market presence spanning Asia, Europe and the United States.

Oy Everon Ab is the Finnish mother company of the small but fast growing Everon group. Headquarters are located in Turku (Åbo) in Finland with two side offices in Norrköping (SE) and Ashford (UK). We currently have a total head count at just over 40.
Since its first beginning Everon has focused on being at the forefront of care technology in its segment. We were the first ones to introduce fully mobile and wireless nurse call systems, our Vega GPS watch was the first professional solution for those living at home with cognitive impairments and now the all new Origon welfare hub brings the expected game change to the care segment.
Our expertise will serve the transformation within care and the Origon is the infrastructure bridge for cloud based client and resource monitoring and optimization. For the first time there will be no technical limits regardless of the form of living of the end users. High level technical health monitoring is available within independent living at the same standards as within facility care.

Precordior Ltd. is a spin-off company from the University of Turku, Finland, founded in 2016. Precordior is focused on commercialising cardiac monitoring know-how originating from the University’s academic research, creating smartphone solutions for detection of various cardiac conditions. The company’s first commercial product is a medically approved smartphone app for detection of atrial fibrillation.
The team is made up of experts in the fields of medicine, health technology, and algorithm development. Together they have extensive experience in international clinical research ranging through phases I-IV in pharmaceutical and medical device R&D, as well as in biosignal processing for development of methods and algorithms for chest motion based detection of atrial fibrillation and other cardiac anomalies.

The research work will be conducted at The Department of Future Technologies (DFT), at University of Turku, while the clinical trials are performed at the Turku University Hospital’s Heart Center.

The Heart Center at the Turku University Hospital is a forerunner in cardiac therapy and the hospital has the latest technology available for cardiac research. Treatments include cardiac surgery, angioplasty, pacemaker installation, cardiac catheterization and arrhythmia treatment using magnetic navigation. The responsibilities of the Heart Center cover heart surgery, general cardiology, treatment of cardiac arrhythmias, coronary arteries and heart failures.

DFT is an internationally acclaimed research unit focusing on multidisciplinary industry-relevant ICTtechnologies and employs approximately 120 staff members. The proposed project benefits from the diversity and wide scope of the research work conducted at DFT, as its successful implementation requires expertise in embedded systems design, signal processing algorithms, and software development. The site of research has access to necessary scientific (such as IEEE and ACM) databases. The required commercial software tools (Matlab, C++ compilers, Cadence, Mentor) are available at the site of research.

The UTU cardiac research program originates from 2011 and has been concentrating in accelerometer and especially gyroscope measurements in mobile and wearable solutions. Our research provides us a profound understanding how cardiac mechanics, rhythm and function can be investigated with these sensors. UTU will contribute to applications, signal processing and algorithm design for multi-modal flexible thin patch.

Aalto University (AALTO KORKEAKOULUSAATIO) is a multidisciplinary scientific and arts community, working in the fields of technology, business and art. It was founded in 2010, when Helsinki University of Technology, the Helsinki
School of Economics and the University of Art and Design Helsinki were merged.
The research group of Electronics Integration and Reliability (EIR) belongs to the Department of Electrical Engineering and Automation at Aalto University School of Electrical Engineering. EIR is operating in Micronova, which is Finland’s National Research Infrastructure for micro- and nanotechnology, jointly run by Aalto University and VTT Technical Research Centre of Finland. Aalto University EIR is specialised in the reliability of high density electronics, 3D integration technologies as well as electrical, thermal, thermomechanical and physicochemical modelling of interconnections.

IDEAS – Integrated Detector Electronics AS – is a fabless supplier of integrated circuits and systems based in Oslo, Norway. The company designs integrated circuits (ICs) and systems for radiation detection and imaging. IDEAS works with research organizations and business partners creating new products based on IDEAS’ custom made ICs. A selection of circuits and systems is available from stock and can be supplied on short notice. IDEAS is specialized in the development of radiation-hardened amplifiers, analog-to-digital converters (ADC) and readout integrated circuits (ROIC) for radiation detectors and image sensors.

Cardiaccs was founded in 2009 by Prof. Erik Fosse as a result of 8 years of research and development by the Intervention Centre at Oslo University Hospital in cooperation with Buskerud and Vestfold University College. Since February 2016, the company has been ISO 13485 certified for design and development of medical devices.

Cardiovascular related diseases are the leading cause of hospitalization and death worldwide, and there is an increase of patients with complex cases where open heart surgeries are required. Cardiaccs wants to cover the urgent  unmet need for better cardiac monitoring to reduce morbidity and mortality in this patient group.

Cardiaccs provides technology for measuring myocardial contractility, a vital parameter for monitoring of the cardiac function. With a continuous and accurate monitoring of the cardiac function, intra- and post-operative complications can be avoided, before a patient becomes critical.

University of South-Eastern Norway (USN) has approximately 18,500 students and 1,600 staff, spread over eight campuses in South-Eastern Norway. USN aims to have a regional foundation, and with eight campuses, we have a strong and clear presence in one of Norway’s most exciting and dynamic regions. USN has a strong focus on research and development. Our strongest research environments are organized into groups and centers that reflect our commercial profile and practical approach to research. The Faculty of Technology, Natural Sciences and Maritime Sciences offers bachelor’s and master’s degrees in a variety of disciplines, including engineering, science, and maritime studies.

Since 2001, research activities at the Department for Microsystems have been dedicated to a strategic and long-term development of research and education in applied micro and nanosystems technology. The research infrastructure has a national standing. Research activities in the Department are centred around the following: Electronic Interconnection & Packaging Technologies, BioMEMS, Materials and micro-integration, Micro Acoustic and Optics, Micro-and Nanoelectromechanical Systems and Micro- and Nano Sensor Technologies. The research groups of Materials and micro-integration and Micro- and nano electromechanical systems at USN are involved in the APPLAUSE project.

Leading manufacturers around the globe rely on ams’ sensing know-how for advanced systems design. For ams, “Sensing is Life” and our passion is in creating the sensor solutions that make devices smarter, safer, convenient and more environment-friendly. ams’ sensor solutions are at the heart of the products and technologies that define our world today – from smartphones and mobile devices to smart homes and buildings, industrial automation, medical technology, and connected vehicles. Our products drive applications requiring small form factor, low power, highest sensitivity and multi-sensor integration. We offer sensors (including optical sensors), interfaces and related software for consumer, communications, industrial, medical, and automotive markets.

Besi Austria GmbH forms part of the larger Dutch group Besi (BE Semiconductor Industries, N.V.), an international group of companies operating in the assembly and packaging sector of the semiconductor industry.

Besi Austria’s main area of expertise is the development and production of high precision and high flexibility assembly and die handling equipment for the semiconductor and microelectronics industries. Besi Austria offers various machine platforms targeting different processes within the semiconductor packaging industry. Machines are designed with focus on modularity, flexibility and customization potential to be able to address technical challenges for highly advanced packaging processes, whilst still maintaining excellent yield, cost of ownership and time-to-market. With these principles in mind, Besi has developed advanced equipment for high end semiconductor packaging processes, such as advanced multi-module system in package (SiP), copper pillar flip chip bonding, thermocompression bonding, and wafer level packaging.

EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers’ fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Leveraging a combination of industry-leading products and process expertise, the company helps customers to achieve cost-effective implementation of emerging semiconductor technologies such as through-silicon-via (TSV) processes for chip packaging and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, AZ.; Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea; Chung-Li, Taiwan and Shanghai, China.

Albis Optoelectronics is a leading designer, developer and manufacturer of high-speed PIN and APD photodiodes for fibre optic datacom and telecom applications. The diversified product portfolio covers digital and analogue applications up to 50 GHz, as well as specialty photodiodes for a variety of applications including telecommunications and data communications, monitoring and sensing, long wavelength LiDAR, and microwave photonic links.
The fabrication facilities based in Rueschlikon (Zurich) offer full in-house production from front-end to backend and includes a class 100 clean room and extensive test and qualification laboratories. New products for emerging markets as well as customer specific modifications are developed by a team of experienced scientists and engineers. The company produces high quality products fulfilling Telcordia GR-468 and MILSTD- 883E requirements.

CSEM—technologies that make the difference

CSEM, founded in 1984, is a research and development center (public-private partnership) specializing in micro-technology, nanotechnology, microelectronics, system engineering, photovoltaics and communications technologies. Around 450 highly qualified specialists from various scientific and technical disciplines work for CSEM in Neuchâtel, Zurich, Muttenz, Alpnach, and Landquart in Switzerland.  They represent more than 20 nationalities and constitute the basis of the company’s creativity, dynamism and innovation potential. CSEM has been very successful in creating over 25 companies.

In microsystems domain, CSEM is covering the full value chain in development of microsystems fabrication and integration. This includes system simulation and design, microfabrication and processing, wafer and chip level packaging, hybrid integration, hermetic sealing and reliability testing. CSEM is involved in numerous national and international initiatives and is serving many industrial clients in this domain addressing different application areas.

CSEM has a long history in advanced chip-level and wafer level packaging technologies in different strategic platforms. One of the strategic objectives in CSEM in packaging domain is to enable new reliable long lasting hermetic packaging solutions for extremely harsh environments.  In this context, CSEM has developed novel low temperature hermetic sealing technologies for temperature sensitive components and to enable low stress joining. Within the Applause project, the TRL (technology readiness level) of these technologies will be increased and scaled up to address new potential applications which will enable new economic exploitation possibilities for the European industry.

Almae technologies SAS is a simplified limited company in operation since February 1st, 2016, created as a spinoff from III-V Lab, a joint laboratory of Nokia Bell Labs, Thales R&D and CEA-Leti. Almae Technologies is located in Marcoussis, south of Paris, France. It has over 2,000 m2 clean room and 40 employees. Almae is focusing on advanced R&D, production and commercialization of innovative photonic technology and next generation products, addressing Telecom and Datacom market demand for very high speed optical data transmission.
The main areas of expertise are:

  • Production of 10G and 25G externally modulated lasers @1.3μm @1.55μm based on semi-insulating buried heterostructure technology platform
    Industrial temperature ridge waveguide high power DFB lasers @1.3μm
  • Epitaxy for Al-based or Al-free multi-quantum well structures with MOCVD and MBE epitaxy equipment Design, testing and module integration of high-speed (25/50G) laser and electro-absorption modulator, uncooled device with a wide temperature range

Almae fast prototyping capabilities will help exploit results in an early phase and offer a seamless transition to a larger scale manufacturing in a fast-growing world market for advanced photonic integrated circuits.

We design, produce and sell metrology equipment for the characterization of semiconductor and photovoltaic materials, for monitoring the manufacturing process of semiconductor devices, flat panel displays and solar cells, and also for R&D purposes in these areas. We offer a variety of measurement techniques; most of them are non-contact and non-destructive. Many of our technologies can be flexibly integrated into different platforms, ranging from simple handheld devices and table-top systems with high resolution mapping capability to fully automated stand-alone production control tools for mid-range and high-level fablines. We also offer in-line measurements for solar cell production lines.

Our strategy is to continuously improve our products, and to offer flexible solutions for our customers’ needs with high-value products for a reasonable price. To accomplish this, we employ 800 people worldwide, including 110 physicists and 90 engineers. We are happy to work together with our customers and partners to find suitable solutions for new challenges, and we also participate in various international R&D projects.

We carry out our work in a responsible way; we provide various benefits to our employees and support important cases such as scientific education.

EDI in Riga, Latvia was founded by law in 1960. As an organization regulated by public law, we are independent state research institute: not part of any university or company.
Currently, EDI is among the highest rated scientific institutions in Latvia specializing in Smart Embedded Cooperative Systems (SECS). Our mission is to perceive the world and design a better future by creating new knowledge,
developing innovative technologies and demonstrating their practical significance in real life applications. This mission drives a scientific staff of over 80 people, who are organized in four laboratories: Signal Processing; Space Technology; Robotics and Machine Perception; and Cyber-Physical System labs.
At EDI we believe that our future world will be even more connected, digital and automated than ever, forming various ambitious challenges to achieve, e.g. personalized predictive and preventive healthcare; flexible, efficient, connected and autonomous (zero defect) factories; safe (zero fatalities), affordable, sustainable, connected, cooperative, automated and clean (zero emissions) mobility; secure, safe and trustable connectivity and system interoperability; to name a few, which will impact everyday life of citizens and all business sectors. At EDI we have a unique perspective, expertise and capacity to contribute in solving all these challenges on global scale. The key driving force of EDI scientific activities is its economic and social impact, therefore we apply our SECS expertise in mobility, industry, health, digital life and space domains. Meanwhile, we are focusing on following research directions: extremely precise event timing; remote sensing and space data processing; robotics and machine perception; signal processing and embedded intelligence; smart sensors and IoT.
Our expertise is complemented by close collaboration with 300+ international partners. EDI have coordinated and participated in numerous EU projects (H2020, ECSEL, ERA-NET, COST, etc.).

NVIDIA’s invention of the GPU (graphics processing unit) in 1999 sparked the growth of the PC gaming market, redefined computer graphics, ignited the era of modern AI and is fueling the creation of the metaverse. NVIDIA is now a full-stack computing company with data-center-scale offerings that are reshaping industry.

NVIDIA accelerated networking solutions, featuring NVIDIA Quantum InfiniBand and Spectrum Ethernet Platforms, gives enterprises infrastructure flexibility to support develop-to-deploy implementations across all modern workloads and storage requirements that enable a new era of accelerated computing to maximize AI investments.

More information: https://www.nvidia.com/

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