Latest article published by APPLAUSE Partners Aalto University and EVG

The APPLAUSE project, which officially ended last year, continues to deliver impact with the latest article published Microelectronic Engineering, volume 286. “Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging”: can be found as Open Access article here: Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging – ScienceDirect.

Technical Highlights

  • Wafer-level low-temperature bonding using solid-liquid interdiffusion method.
  • Si and Borosilicate wafers with dissimilar thermomechanical properties have been successfully bonded.
  • The bonding process was carried out at temperatures as low as 170 °C.
  • The interconnection was composed of Cu/Cu6(Sn,In)5/Cu microstructure.
  • Cap-deflection measurements verify that the bonds are hermetic after the bonding and dicing processes.

Congratulations to Vesa Vuorinen, Obert Golim, Mervi Paulasto-Kröckel, Tobias Wernicke, Marta Pawlak, from partner organisations Aalto University and EVG. 

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