? Walk of Fame: APPLAUSE: Advancing European Competitiveness through Advanced Packaging for Optical, Photonics, and Electrical Parts ? In the quest for innovative packaging solutions for mass-produced optical, photonics, and electrical parts, the EU-funded APPLAUSE project offers a promising path forward. Led by top experts, APPLAUSE aims to develop new processes, methods, and tools for […]
The APPLAUSE project, which officially ended last year, continues to deliver impact with the latest article published Microelectronic Engineering, volume 286. “Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging”: can be found as Open Access article here: Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging – ScienceDirect. Technical Highlights […]
One year after the official project end, two news worthy pieces from APPLAUSE Partner Fraunhofer IZM The first is a blog post/interview “Efficiency meets affordability: A robust wafer-level packaging process for low-cost infrared cameras” with Charles-Alix Mannier regarding developments made in Use Case 2: https://lnkd.in/e7SD-6rh. The interview includes a short video of Charles-Alix explaining some of the […]
APPLAUSE Project Partners held a successful Final Review last week in Paris. Reviewers were impressed with the projects’ technical results linked through our five main Use Cases which were showcased in the demonstration room, alongside scientific posters highlighting technical achievements. Rounding up the event we focused on the exploitation plans for each of the 30 […]
APPLAUSE Project Partners are gearing up for the Final Review next week, 30th-31st January. We look forward to sharing all the results and plans going forward after the official project has ended. It’s been a long journey with COVID19 adding an extra challenge but there has been ongoing excellent collaboration across our different consortium partner […]
Work Package Lead, Dr. Charles-Alix Manier presented a webinar on 1st December 2022 which included reference to the work developed in Use Case 3. Watch the full presentation here: Specific reference to the APPLAUSE work is from 13 minutes onwards. Thanks to Dr. Manier for this presentation and to the teams involved for the work! […]
Time flies! Almost one month ago in Berlin, APPLAUSE held a one-day dissemination session within the ESREF 2022 conference (33rd European Symposium on Reliability of Electron Devices Failure Physics and Analysis, September 26-29, 2022). More information about ESREF here: ESREF 2022 | 33rd European Symposium on Reliability of Electron Devices Failure Physics and Analysis Three […]
Helene Debregeas from Almae Technologies was invited to give a workshop at ECIO (European Conference on Integrated Optics), which was held on May 4th to 6th 2022, in Milan, Italy. The topic of the workshop was “Towards passive hybridization of high-power and high-speed InP transmitters”.
Last month, the APPLAUSE related article, “Demonstrating 170 °C Low-Temperature Cu–In–Sn Wafer-Level Solid Liquid Interdiffusion Bonding” was featured in the IEEE Transactions on Components, Packaging and Manufacturing Technology popular articles list. Direct link to open access here: Demonstrating 170 °C Low-Temperature Cu–In–Sn Wafer-Level Solid Liquid Interdiffusion Bonding | IEEE Journals & Magazine | IEEE Xplore – Congrats […]
Members from the APPLAUSE Project Consortium will be attending the online EFECS 2021 event this week Tuesday 23rd to Thursday 25th November. Search for our APPLAUSE ‘booth’ and come and have a chat! Colleagues from KLA ICOS (Belgium) Besi (Austria + Netherlands), IDEAS (Norway), EDI (Latvia), ams Osram (Austria), Nuromedia (Germany) and more will be […]
