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This project has received funding from the ECSEL Joint Undertaking (JU) under grant agreement No 826588. The JU receives support from the European Union’s Horizon 2020 research and innovation programme and Belgium, Germany, Netherlands, Finland, Austria, France, Hungary, Latvia, Norway, Switzerland, Israel.
APPLAUSE mentioned in CHIPS JU “Walk of fame”
🌟 Walk of Fame: APPLAUSE: Advancing European Competitiveness through Advanced Packaging for Optical, Photonics, and Electrical Parts 🌟
In the quest for innovative packaging solutions for mass-produced optical, photonics, and electrical parts, the EU-funded APPLAUSE project offers a promising path forward. Led by top experts, APPLAUSE aims to develop new processes, methods, and tools for high-volume mass manufacturing of electrical and optical components. By piloting these technologies in five manufacturing use cases and fostering collaboration across the value chain, APPLAUSE seeks to strengthen the European packaging industry’s competitiveness.
🎯 Objectives:
-Develop new tools, methods, and processes for high-volume manufacturing.
-Pilot test technologies in five manufacturing use cases.
-Strengthen European packaging industry competitiveness.
Key Highlights:
-Focus on advanced assembly and packaging technologies.
-Structured work plan covering management, R&D, testing, and pilot production.
-Deliverables include use case demonstrators, advanced packaging technologies, and joint development trajectories.
Read more about the project here: Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe | APPLAUSE | Project | News & Multimedia | H2020 | CORDIS | European Commission (europa.eu)
Latest article published by APPLAUSE Partners Aalto University and EVG
The APPLAUSE project, which officially ended last year, continues to deliver impact with the latest article published Microelectronic Engineering, volume 286. “Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging”: can be found as Open Access article here: Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging – ScienceDirect.
Technical Highlights
Congratulations to Vesa Vuorinen, Obert Golim, Mervi Paulasto-Kröckel, Tobias Wernicke, Marta Pawlak, from partner organisations Aalto University and EVG.
APPLAUSE Partner Fraunhofer IZM
One year after the official project end, two news worthy pieces from APPLAUSE Partner Fraunhofer IZMÂ
The first is a blog post/interview “Efficiency meets affordability: A robust wafer-level packaging process for low-cost infrared cameras” with Charles-Alix Mannier regarding developments made in Use Case 2:Â https://lnkd.in/e7SD-6rh. The interview includes a short video of Charles-Alix explaining some of the key innovations made during the project.
The second is a paper and publication “Wafer Level Capping Technology for Vacuum Packaging of Microbolometers,” given at the 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC): https://lnkd.in/dKnkrh2w (subscription needed).
Congrats to Fraunhofer and APPLAUSE partners for continuing the great work!
Successful Project Final Review meeting held
APPLAUSE Project Partners held a successful Final Review last week in Paris. Reviewers were impressed with the projects’ technical results linked through our five main Use Cases which were showcased in the demonstration room, alongside scientific posters highlighting technical achievements. Rounding up the event we focused on the exploitation plans for each of the 30 partner organisations, where we expect great impact for Europe. Thanks to all in attendance! We will give an update soon about the public APPLAUSE results.
#KDT #integratedoptics #H2020 #semiconductor #innovation #collaboration #photonics #advancedpackaging #ECSEL #optics
APPLAUSE Project Partners are gearing up for the Final Review
APPLAUSE Project Partners are gearing up for the Final Review next week, 30th-31st January. We look forward to sharing all the results and plans going forward after the official project has ended. It’s been a long journey with COVID19 adding an extra challenge but there has been ongoing excellent collaboration across our different consortium partner organisations – Large Enterprises, SMEs and RTOs and their respective technical teams. Big thanks to them! Looking forward to meeting face-to-face again and sharing the impressive developments!
APPLAUSE partner Fraunhofer IZM held informative webinar on passive alignment, including developments from Use Case 3
Work Package Lead, Dr. Charles-Alix Manier presented a webinar on 1st December 2022 which included reference to the work developed in Use Case 3. Watch the full presentation here:
Specific reference to the APPLAUSE work is from 13 minutes onwards. Thanks to Dr. Manier for this presentation and to the teams involved for the work!
Fraunhofer hold regular webinar sessions, more information here:
https://www.izm.fraunhofer.de/en/news_events/trainings-and-workshops/izm-photonics–in-optical-interconnects-we-trust.html