SEMICON Europa is back as in-person event in 2021! This year SEMICON Europa will be co-located with productronica in Munich, Germany, creating the strongest single event for electronics manufacturing in Europe, and broadening the range of attendees across the electronics chain. The following Applause project partners are warmly welcoming visitors at their booths! JSR at […]
Come and join us virtually at the APPLAUSE Booth at EFECS 2020 this week 25th and 26th November. Learn more about the project by visiting our booth where you can check the latest information and contact us directly using the chat function. Welcome! More information on the event can be found at: https://efecs.vfairs.com/
The 8th Electronics System-Integration Technology Conference (ESTC) running this year 15th-18th September will be a fully virtual live event which will allow for real-time interactions. The conference programme includes five keynote presentations, a live workshop on Heterogeneous Integration Roadmap (HIR), three more plenary Special Sessions, and a virtual exhibition. The extensive programme consists of 90 […]
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic system science, technology and education. Last month, the ECTC 2020, sponsored by the IEEE Electronics Packaging Society, was held for the first time in a virtual format. Birgit Brandstätter from APPLAUSE Partner Besi […]
The APPLAUSE Project held a successful online Month 12 Consortium Meeting in the last week of April. Unable to meet in person due to the current coronavirus situation, we had a great level of attendance on the teleconference – all Partner organisations represented and up to 55 people on the call. Status updates were given […]
Last month, prior to the major travel restrictions, Vesa Vuorinen from APPLAUSE Partner Aalto University, presented at The Minerals, Metals & Materials Society (TMS) in San Diego, California. The TMS Annual Meeting & Exhibition brings together more than 4,000 engineers, scientists, business leaders, and other professionals in the materials’ science field for a comprehensive, cross-disciplinary […]
There was very good attendance from the project consortium for the day and a half event, with 47 individuals present, representing 31 partner organisations.
A consortium of 31 European electronics packaging, optics and photonics key players, leading equipment suppliers and testing experts launched a new project, “Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe,” simply called APPLAUSE. The project fosters the European semiconductor value chain by building new tools, methods and processes for high […]
The APPLAUSE ECSEL-JU project kicked off in Leuven the 21-22th May 2019 with the full consortium present. The first day focused on the project scope, practicalities and work package presentations by the work package leaders. The second day focused on specifics of the work packages and planning the work. The event was hosted by ICOS.
