Come to meet our partners at SEMICON

SEMICON Europa is back as in-person event in 2021! This year SEMICON Europa will be co-located with productronica in Munich, Germany, creating the strongest single event for electronics manufacturing in Europe, and broadening the range of attendees across the electronics chain.

The following Applause project partners are warmly welcoming visitors at their booths!

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Welcome to visit our virtual booth at EFECS 2020

Come and join us virtually at the APPLAUSE Booth at EFECS 2020 this week 25th and 26th November. Learn more about the project by visiting our booth where you can check the latest information and contact us directly using the chat function. Welcome! More information on the event can be found at: https://efecs.vfairs.com/ 

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EPS European flagship event – ESTC 2020 (15-18 September) – Register now for this fully virtual, live and interactive conference!

The 8th Electronics System-Integration Technology Conference (ESTC) running this year 15th-18th September will be a fully virtual live event which will allow for real-time interactions. The conference programme includes five keynote presentations, a live workshop on Heterogeneous Integration Roadmap (HIR), three more plenary Special Sessions, and a virtual exhibition. The extensive programme consists of 90 oral presentations and more than 30 poster presentations. The keynote and special sessions will be recorded so nothing will be missed!

Register now, for this exciting virtual, live conference! ESTC is the European flagship conference of EPS, this year hosted by APPLAUSE Project Partner University of South-Eastern Norway, located in Vestfold, the “Electronic Coast” of Norway. 

Registration link to ESTC 2020: https://www.estc-conference.net/estc-2020/registration-1

Note, the price will increase by €40 Euros after 24th August.

USN, in addition to taking on the local organiser role, are active APPLAUSE Project Partners and will give two APPLAUSE related poster presentations:

“A Simulation of Optical Scattering of IR-light Through a Micromachined Silicon Lid”, presented by Phillip Papatzacos, USN

“Evaluation on Silicon Diaphragms for Hermetic Packaging of Microbolometer Arrays”, presented by Hexin Xia, USN

 APPLAUSE Project  is further represented by Vesa Vuorinen, Aalto University, Finland who will give the oral presentation:

“Study of Cu-Sn-In System for Low Temperature, Wafer Level Solid Liquid Inter-Diffusion Bonding”

Don’t miss out on this expert forum! Further information for the conference programme can be found here: https://www.estc-conference.net/estc-2020/conference-schedule.

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Besi Austria GmbH presented recent work on ultra-high accuracy chip-to-wafer bonding at ECTC June 2020

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic system science, technology and education. Last month, the ECTC 2020, sponsored by the IEEE Electronics Packaging Society, was held for the first time in a virtual format.

Birgit Brandstätter from APPLAUSE Partner Besi Austria GmbH presented their recent work on ultra-high accuracy chip-to-wafer bonding in a video presentation. Besi Austria GmbH acknowledged the APPLAUSE project and EU and Austrian funding support.

Visit Besi’s website for further details of the publication and to download a PDF version: https://www.besi.com/scientific-publications/. More information about the conference can be found at their ECTC webpages (http://ectc.net/).

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Progress updates given in Month 12 online meeting

The APPLAUSE Project held a successful online Month 12 Consortium Meeting in the last week of April. Unable to meet in person due to the current coronavirus situation, we had a great level of attendance on the teleconference – all Partner organisations represented and up to 55 people on the call. Status updates were given by the Workpackage and Use Case leads. The project progresses well! Thanks to all the contributing Partners! Watch this space for new updates and results as they come out of the project.

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APPLAUSE Partner Aalto University, speaks at TMS2020

Last month, prior to the major travel restrictions, Vesa Vuorinen from APPLAUSE Partner Aalto University, presented at The Minerals, Metals & Materials Society (TMS) in San Diego, California. The TMS Annual Meeting & Exhibition brings together more than 4,000 engineers, scientists, business leaders, and other professionals in the materials’ science field for a comprehensive, cross-disciplinary exchange of technical knowledge. Vesa and colleagues presented their recent work on Wafer Level SLID Bonding and acknowledged the APPLAUSE project and EU funding support.

Vesa explained: “These large events offer excellent visibility for our novel research to an international audience and provide a nice platform for good discussions on future topics ”

The TMS 2020 Event page can be found here and the technical program in detail found here.


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APPLAUSE Project meeting in Espoo, Finland 18-19th November 2019

There was very good attendance from the project consortium for the day and a half event, with 47 individuals present, representing 31 partner organisations.

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APPLAUSE – an ECSEL Joint Undertaking project – focuses on developing advanced packaging for photonics, optics and electronics for low cost manufacturing

A consortium of 31 European electronics packaging, optics and photonics key players, leading equipment suppliers and testing experts launched a new project, “Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe,” simply called APPLAUSE. The project fosters the European semiconductor value chain by building new tools, methods and processes for high volume manufacturing. The 34M€ total budget for the three-year project is co-funded by Horizon 2020 and national funding agencies and industries, as a part of the Electronics Components and Systems for European Leadership Joint Undertaking (ECSEL JU).

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APPLAUSE Kick-off Meeting in Leuven, 21-22 May 2019

The APPLAUSE ECSEL-JU project kicked off in Leuven the 21-22th May 2019 with the full consortium present. The first day focused on the project scope, practicalities and work package presentations by the work package leaders. The second day focused on specifics of the work packages and planning the work. The event was hosted by ICOS.

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