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This project has received funding from the ECSEL Joint Undertaking (JU) under grant agreement No 826588. The JU receives support from the European Union’s Horizon 2020 research and innovation programme and Belgium, Germany, Netherlands, Finland, Austria, France, Hungary, Latvia, Norway, Switzerland, Israel.
APPLAUSE project successful dissemination day and summer school
Time flies! Almost one month ago in Berlin, APPLAUSE held a one-day dissemination session within the ESREF 2022 conference (33rd European Symposium on Reliability of Electron Devices Failure Physics and Analysis, September 26-29, 2022). More information about ESREF here: ESREF 2022 | 33rd European Symposium on Reliability of Electron Devices Failure Physics and Analysis
Three sessions were created with six main presentations given by consortium members focused on the results from the project. We had a good-sized audience from the conference attendees, many of whom heard about APPLAUSE for the first time. The day ended with the symposium poster session in which APPLAUSE had nine posters and a large screen showing the infra-red camera capabilities. More than one hundred attendees circulated, discussing the latest technological developments.
This was followed by a two-day ‘summer school’ with nineteen high-quality lectures for more than twenty students and young engineers. More information on the program here: Summer school – APPLAUSE (applause-ecsel-ju.eu). The project gives thanks to all those who helped arrange the event, who presented and to the active attendees – all of whom created this great educational event!
Towards passive hybridization of high-power and high-speed InP transmitters -workshop at ECIO
Helene Debregeas from Almae Technologies was invited to give a workshop at ECIO (European Conference on Integrated Optics), which was held on May 4th to 6th 2022, in Milan, Italy. The topic of the workshop was “Towards passive hybridization of high-power and high-speed InP transmitters”.
APPLAUSE results create more impact
Last month, the APPLAUSE related article, “Demonstrating 170 °C Low-Temperature Cu–In–Sn Wafer-Level Solid Liquid Interdiffusion Bonding” was featured in the IEEE Transactions on Components, Packaging and Manufacturing Technology popular articles list. Direct link to open access here: Demonstrating 170 °C Low-Temperature Cu–In–Sn Wafer-Level Solid Liquid Interdiffusion Bonding | IEEE Journals & Magazine | IEEE Xplore – Congrats Vesa Vuorinen et al.
The next published APPLAUSE related article “Finite Element Simulation of Solid–Liquid Interdiffusion Bonding Process: Understanding Process-Dependent Thermomechanical Stress” can now be found in the most popular IEEE Transactions on Components, Packaging and Manufacturing Technology reading list (May 2022). Congrats!
Come to meet us at EFECS!
Members from the APPLAUSE Project Consortium will be attending the online EFECS 2021 event this week Tuesday 23rd to Thursday 25th November.
Search for our APPLAUSE ‘booth’ and come and have a chat! Colleagues from KLA ICOS (Belgium) Besi (Austria + Netherlands), IDEAS (Norway), EDI (Latvia), ams Osram (Austria), Nuromedia (Germany) and more will be at the event as well, so don’t hesitate to search for us on the networking tool of the event.
Come to meet our partners at SEMICON
SEMICON Europa is back as in-person event in 2021! This year SEMICON Europa will be co-located with productronica in Munich, Germany, creating the strongest single event for electronics manufacturing in Europe, and broadening the range of attendees across the electronics chain.
The following Applause project partners are warmly welcoming visitors at their booths!
Welcome to visit our virtual booth at EFECS 2020
Come and join us virtually at the APPLAUSE Booth at EFECS 2020 this week 25th and 26th November. Learn more about the project by visiting our booth where you can check the latest information and contact us directly using the chat function. Welcome! More information on the event can be found at: https://efecs.vfairs.com/